PicoMaster具有短皮秒脈沖的特性，幾乎可以加工任何材料，是一種經(jīng)濟(jì)高效的選擇，PicoMaster的工業(yè)化設(shè)計使其能夠在相對較高的速度下對幾乎任何材料進(jìn)行微米量級的加工。

特性

• 10 ps 超快皮秒激光光源
• 小至 5 µm 的激光光斑
• 最高達(dá) 100 kHz 的重復(fù)頻率
• 高精度三維 XYZ 工件定位
• 單脈沖激光能量可達(dá) 200 µJ
• 重復(fù)性高
• 可進(jìn)行亞波長級的加工
• 材料去除率高
• 可根據(jù)要求提供多種波長的激光光源
• 符合Class 1 激光安全標(biāo)準(zhǔn)
• 運行維護(hù)成本低
• 通用火線 (IEEE-1394)計算機(jī)控制接口
• 控制方便

相關(guān)應(yīng)用

• 打孔:
  – 各種材料上幾微米至幾百微米直徑圓形孔的加工
  – 高深徑比注射器打孔
  – 氣化噴霧和注射噴嘴打孔
• 剝蝕
• 打標(biāo)（表面和透明材料內(nèi)部）
• 切割
• 表面結(jié)構(gòu)紋理的加工和制備

該系統(tǒng)的核心是能夠達(dá)到100KHz的高重復(fù)頻率的半導(dǎo)體泵浦固體激光器件，先進(jìn)的光學(xué)設(shè)計和制作能夠保證激光光點小于5微米。高度自動化的控制系統(tǒng)，操作簡單易用。而用戶友好的開放性軟件保證了系統(tǒng)加工能力的靈活性-可根據(jù)應(yīng)用自由改造。該系統(tǒng)使用的是對人體安全的I級激光，而良好的封閉外圍， 隔離振動的加工平臺保證足以確保超精細(xì)加工的可信性。
對于希望獲得節(jié)省時間和成本，同時要求高精度理想脈寬的激光，快速高精度定位和激光聚焦的科研人員或工程師而言，PicoMaster是個絕佳的選擇。

豐富的用戶定制可選功能

• 視頻監(jiān)測系統(tǒng)用于加工過程控制
• 雙軸電流計式振鏡用于復(fù)雜的高速激光束掃描，切割式鉆孔，以及激光刻劃
• 用于螺旋鉆孔和光束偏振控制的特殊光路系統(tǒng)
• 旋轉(zhuǎn)和傾斜軸增加了加工的自由度
• 用戶定制軟件功能
• 1064 nm, 532 nm, 355 nm (和/或)工作波長
• 配用其它類型激光器

Picomaster series ultrafast micromachining workstation design

A Class 1 laser-safe enclosure conceals:

Positioning system
Positioning axes are supported by a rigid vibrationisolated granite platform. Mechanical robustness ensures high positioning accuracy at high speed and for high fabrication volumes. Once a galvo-scanner is added, the processing speed in 2D rises to extreme values, whereas the rotary and tilt axes transform the workstation into a truly 3D tool.

Laser choice

• PL10100 with CW diode pumped regenerative amplifier – a good balance between pulse repetition rate and pulse energy
• PL11M with cavity-dumped oscillator – MHz pulse repetition rate
• FOXTROT with pulsed-diode-pumped amplifier – the highest pulse energy
• 1064, 532 and/or 355 nm wavelength, adjustable to material/process
• Integrated pulse and energy control providing flexible pulse-on-demand and burst mode operation, as well as fluence manipulation.

Optics

Advanced beam delivery scheme and cleverly designed focusing optics couple to precisely deliver the laser energy to the target spot intended. Wide range of laser fluences is available for the laser machining process.

Software

• Real-time operation in MS Windows environment
• Synchronized control of positioning and laser subsystems
• Possibility to integrate additional process-specific devices
• Compatibility with CAD and graphic file formats

Advanced software provides full automatic control of all system units. Intuitive and easy at use, it makes the system either flexibly adaptive or process specific. To speed the work up, two different kinds of parameters can be saved into separate files, namely: system parameters (such as speed of positioning

stages, laser pulse repetition rate etc.) apart from those related to processing „geometry“ (size, depth, arrangement etc.). Remote control and fast support via internet is foreseen.

Options

• Vacuum chuck and workpiece fixture
• Rotary and tilt/dwell axes for increased performance
• Vision control with CCD camera